All-in-One Hardware, Coin-Sized.
What is Corezzle SiP?
Corezzle offers System-in-Package solutions that integrate the processor, RAM, eMMC, power management, and passive components into a single compact package.
🧠 Integrate AI hardware in a single step
🔧 Hardware design now takes days, not weeks
📐 Eliminate complexity with a modular structure
Optımızed for AI
Designed for Edge AI and IoT applications.
Hıgh Compatıbılıty
Works seamlessly wıth YOCTO Lınux and Androıd.
Compact Dımensıons
Smaller and lighter devices.
All-ın-One
Processor, memory, and power management in a single package.
Rapıd Prototypıng
Shrink traditional PCB design cycles down to days.
Industrıal-Grade Durabılıty
Built for defense, automotıve, healthcare, and industrial use.
🚀 Applications
- Autonomous Systems,
- Smart Cameras
- Edge LLM Devices
- Industrial IoT
Empower your devices with AI, simplify your hardware stack, and bring innovation faster with Corezzle.
Frequently Asked Questions (FAQ)
Corezzle is a technology company that develops customized System-in-Package (SiP) solutions for artificial intelligence applications. Our modules integrate key components like CPU, RAM, PMIC, and eMMC into a compact 30x30 mm footprint.
Ready to transform your hardware with Corezzle?
Take the first step towards faster, smaller, and smarter electronic design.
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System in Package (SiP) Teknolojisi: Geleceğin Entegre Çözümleri
